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TPD4123AK
TOSHIBA Intelligent Power Device High Voltage Monolithic Silicon Power IC
TPD4123AK
The TPD4123AK is a DC brush less motor driver using high voltage PWM control. It is fabricated by high voltage SOI process. It is three-shunt resistor circuit for current sensing. It contains level shift high-side driver, low-side driver, IGBT outputs, FRDs and protective functions for under voltage protection circuits and thermal shutdown circuit. It is easy to control a DC brush less motor by just putting logic inputs from a MPU or motor controller to the TPD4123AK.
HDIP26-P-1332-2.00
Weight: 3.8 g (typ.)
Features
* * * * * * * * * * High voltage power side and low voltage signal side terminal are separated. It is the best for current sensing in three shunt resistance. Bootstrap circuit gives simple high-side supply. Bootstrap diodes are built in. A dead time can be set as a minimum of 1.4s, and it is the best for a Sine-wave from drive. 3-phase bridge output using IGBTs. FRDs are built in. Included under voltage protection and thermal shutdown. The regulator of 7V (typ.) is built in. Package: 26-pin DIP.
This product has a MOS structure and is sensitive to electrostatic discharge. When handling this product, ensure that the environment is protected against electrostatic discharge.
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Marking
GND 1 NC 2 NC 3 HU 4 HV 5 HW 6 LU 7 LV 8 LW 9 SD 10 DIAG 11 NC 12 VREG 13 NC 14 VCC 15 GND 16
19 IS1 25 W 24 BSW 26 IS3 23 VBB
Pin Assignment
Part No. (or abbreviation code)
TPD4123AK TPD4125K
2
Lot Code (Weekly code)
22 V 21 BSV
20 IS2
18 BSU 17 U
TPD4123AK
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Block Diagram
VCC 15
18 BSU 21 BSV 24 BSW 7V Regulator 23 VBB UnderUnderUndervoltage voltage voltage Protection Protection Protection Undervoltage Protection High-side Level Shift Driver
VREG 13
HU HV HW LU LV LW
4 5 6 7 8 9 Low-side Driver Input Control Thermal Shutdown 17 U 22 V 25 W
SD 10 DIAG 11
26 IS3 20 IS2 19 IS1 1/16 GND
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Pin Description
Pin No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 Symbol GND NC NC HU HV HW LU LV LW SD DIAG NC VREG NC VCC GND U BSU IS1 IS2 BSV V VBB BSW W IS3 Ground pin. Unused pin, which is not connected to the chip internally. Unused pin, which is not connected to the chip internally. The control terminal of IGBT by the high side of U. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the high side of V. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the high side of W. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the low side of U. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the low side of V. It turns off less than 1.5V. It turns on more than 2.5V. The control terminal of IGBT by the low side of W. It turns off less than 1.5V. It turns on more than 2.5V. Input pin of external protection. ("L" active, It doesn't have hysteresis) With the diagnostic output terminal of open drain, a pull-up is carried out by resistance. It turns on at the time of unusual. Unused pin, which is not connected to the chip internally. 7V regulator output pin. Unused pin, which is not connected to the chip internally. Control power supply pin. (15V typ.) Ground pin. U-phase output pin. U-phase bootstrap capacitor connecting pin. U-phase IGBT emitter and FRD anode pin. V-phase IGBT emitter and FRD anode pin. V-phase bootstrap capacitor connecting pin. V-phase output pin. High-voltage power supply input pin. W-phase bootstrap capacitor connecting pin. W-phase output pin. W-phase IGBT emitter and FRD anode pin. Pin Description
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Equivalent Circuit of Input Pins
Internal circuit diagram of HU, HV, HW, LU, LV, LW input pins
200 k
HU/HV/HW LU/LV/LW
2 k
2 k 6.5 V 6.5 V
2 k 6.5 V 6.5 V
To internal circuit
Internal circuit diagram of SD pin
VREG 200 k
SD
2 k
2 k
2 k 6.5 V 6.5 V
To internal circuit
6.5 V 6.5 V
Internal circuit diagram of DIAG pin
DIAG
To internal circuit 26 V
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TPD4123AK
Timing Chart
HU
HV
HW
Input Voltage
LU
LV
LW
VU
Output voltage VV
VW
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Truth Table
Input Mode Normal HU H H L L L L Thermal shutdown H H L L L L HV L L H H L L L L H H L L L L H H L L L L H H L L * HW L L L L H H L L L L H H L L L L H H L L L L H H * LU L L L H H L L L L H H L L L L H H L L L L H H L * LV H L L L L H H L L L L H H L L L L H H L L L L H * LW L H H L L L L H H L L L L H H L L L L H H L L L * SD H H H H H H H H H H H H H H H H H H H H H H H H L ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF High side OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF Low side ON OFF OFF OFF OFF ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON OFF OFF OFF OFF ON OFF OFF ON ON OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF ON ON OFF OFF OFF OFF U phase V phase W phase U phase V phase W phase DIAG OFF OFF OFF OFF OFF OFF ON ON ON ON ON ON ON ON ON ON ON ON OFF OFF OFF OFF OFF OFF ON
VCC Under-voltage
H H L L L L
VBS Under-voltage
H H L L L L
SD
*
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Absolute Maximum Ratings (Ta = 25C)
Characteristics Power supply voltage Output current (DC) Output current (pulse) Input voltage VREG current Power dissipation (Tc = 25C) Operating temperature Junction temperature Storage temperature Symbol VBB VCC IOUT IOUTp VIN IREG PC Tjopr Tj Tstg Rating 500 18 1 2 -0.5 to 7 50 23 -40 to 135 150 -55 to 150 Unit V V A A V mA W C C C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings and the operating ranges. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc).
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Electrical Characteristics (Ta = 25C)
Characteristics Operating power supply voltage Symbol VBB VCC IBB Current dissipation ICC IBS (ON) IBS (OFF) Input voltage SD input voltage Input current VIH VIL VSD IIH IIL ISDH ISDL VCEsatH VCEsatL VFH VFL VF (BSD) VREG TSD TSD VCCUVD VCCUVR VBSUVD VBSUVR VDIAGsat ton toff tdead trr IDIAG = 5 mA VBB = 280 V, VCC = 15 V, IC = 0.5 A VBB = 280 V, VCC = 15 V, IC = 0.5 A VBB = 280 V, VCC = 15 V, IC = 0.5 A VBB = 280 V, VCC = 15 V, IC = 0.5 A VBB = 450 V VCC = 15 V VBS = 15 V, high side ON VBS = 15 V, high side OFF VIN = "H", VCC = 15 V VIN = "L" , VCC = 15 V VCC = 15 V VIN = 5 V VIN = 0 V VIN = 5 V VIN = 0 V VCC = 15 V, IC = 0.5 A, high side VCC = 15 V, IC = 0.5 A, low side IF = 0.5 A, high side IF = 0.5 A, low side IF = 500 A VCC = 15 V, IO = 30 mA VCC = 15 V VCC = 15 V Test Condition Min 50 13.5 2.5 6.5 135 10 10.5 8 8.5 1.4 Typ. 280 15 0.9 230 200 2.5 2.4 2.4 1.5 1.5 0.9 7 50 11 11.5 9 9.5 1.4 1.0 200 Max 450 16.5 0.5 5 410 370 1.5 150 100 100 150 3 3 2.0 2.0 1.2 7.5 185 12 12.5 9.5 10.5 0.5 3 3 Unit V
mA
A
V V A
SD Input current
A
Output saturation voltage
V
FRD forward voltage BSD forward voltage Regulator voltage Thermal shutdown temperature Thermal shutdown hysteresis VCC under voltage protection VCC under voltage protection recovery VBS under voltage protection VBS under voltage protection recovery DIAG saturation voltage Output on delay time Output off delay time Dead time FRD reverse recovery time
V V V C C V V V V V s s s ns
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Application Circuit Example
15V VCC 15 C4 + C5 18 21 24 13 7V Regulator UnderUnderUndervoltage voltage voltage Protection Protection Protection High-side Level Shift Driver Thermal Shutdown Low-side Driver 26 IS3 20 IS2 19 IS1 R R R 17 22 25 U V W 23
BSU BSV BSW VBB
+ C6
C7
VREG
Undervoltage Protection HU Control IC or Microcomputer HV HW LU LV LW R1 R2 4 5 6 7 8 9 Input Control
C1 C2 C3 C
M
DIAG 11 10 SD
1/16 GND
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External Parts
Typical external parts are shown in the following table.
Part C1, C2, C3 C4 C5 C6 C7 R1 R2 Typical 25 V/2.2 F 25 V/10 F 25 V/0.1 F 25 V/1 F 25 V/1000 pF 5.1 k 10 k Purpose Bootstrap capacitor VCC power supply stability VCC for surge absorber VREG power supply stability VREG for surge absorber DIAG pin pull-up resistor SD pin pull-up resistor Remarks (Note 1) (Note 2) (Note 2) (Note 2) (Note 2) (Note 3)
Note 1: The required bootstrap capacitance value varies according to the motor drive conditions. The capacitor is biased by VCC and must be sufficiently derated for it. Note 2: When using this product, adjustment is required in accordance with the use environment. When mounting, place as close to the base of this product leads as possible to improve the ripple and noise elimination. Note 3: The DIAG pin is open drain. If not using the DIAG pin, connect to the GND.
Handling precautions
Please control the input signal in the state to which the VCC voltage is steady. Both of the order of the VBB power supply and the VCC power supply are not cared about either. Note that if the power supply is switched off as described above, this product may be destroyed if the current regeneration route to the VBB power supply is blocked when the VBB line is disconnected by a relay or similar while the motor is still running. The excess voltage such as the voltage surge which exceed the maximum rating is added, for example, may destroy the circuit. Accordingly, be careful of handling this product or of surge voltage in its application environment.
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Description of Protection Function
(1) Under voltage protection This product incorporates under voltage protection circuits to prevent the IGBT from operating in unsaturated mode when the VCC voltage or the VBS voltage drops. When the VCC power supply falls to this product internal setting VCCUVD (=11 V typ.), all IGBT outputs shut down regardless of the input. This protection function has hysteresis. When the VCC power supply reaches 0.5 V higher than the shutdown voltage (VCCUVR (=11.5 V typ.)), this product is automatically restored and the IGBT is turned on again by the input. DIAG output is reversed at the time of VCC under-voltage protection. When the VCC power supply is less than 7 V, DIAG output isn't sometimes reversed. When the VBS supply voltage drops VBSUVD (=9 V typ.), the high-side IGBT output shuts down. When the VBS supply voltage reaches 0.5 V higher than the shutdown voltage (VBSUVR (=9.5 V typ.)), the IGBT is turned on again by the input signal. (2) Thermal shutdown This product incorporates a thermal shutdown circuit to protect itself against the abnormal state when its temperature rises excessively. When the temperature of this chip rises to the internal setting TSD due to external causes or internal heat generation, all IGBT outputs shut down regardless of the input. This protection function has hysteresis TSD (=50C typ.). When the chip temperature falls to TSD - TSD, the chip is automatically restored and the IGBT is turned on again by the input. Because the chip contains just one temperature detection location, when the chip heats up due to the IGBT, for example, the differences in distance from the detection location in the IGBT (the source of the heat) cause differences in the time taken for shutdown to occur. Therefore, the temperature of the chip may rise higher than the thermal shutdown temperature when the circuit started to operate. (3) SD pin SD pin is the input signal pin to shut down the internal output IGBT. Output of all IGBT is shuted down after delay times (2 s typ.) when "L" signal is inputed to the SD pin from external circuit (MCU etc.). It is possible to shut down IC when overcurrent and others is detected by external circuit. Shut down state is released by all of IC input signal "L". At open state of SD pin, shut down function can not operate.
Timing Chart of Under voltage protection and SD Function
SD LIN HIN VBS VCC LO HO DIAG Note: The above timing chart is considering the delay time ton
toff ton toff
Safe Operating Area
Peak winding current (A) 1.0
0 0 450 Power supply voltage VBB (V) Figure 1 SOA at Tj = 135 C
Note 1: The above safe operating areas are Tj = 135 C (Figure 1).
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VCEsatH - Tj
VCC = 15 V 3.0 IC = 500 mA 2.6
VCEsatL - Tj VCEsatL (V)
3.4 VCC = 15 V 3.0 IC = 500 mA IC = 700 mA
(V)
3.4 IC = 700 mA
VCEsatH
IGBT saturation voltage
2.2 IC = 300 mA 1.8
IGBT saturation voltage
2.6
2.2 IC = 300 mA 1.8
1.4 -50
0
50
100
150
1.4 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
VFH - Tj (V) VFL (V)
1.8 1.8
VFL - Tj
VFH
IF = 700 mA 1.6 IF = 500 mA 1.4
1.6
IF = 700 mA
FRD forward voltage
FRD forward voltage
IF = 500 mA 1.4 IF = 300 mA 1.2
IF = 300 mA 1.2
1.0 -50
0
50
100
150
1.0 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
ICC - VCC
2.0 Tj =-40C 8.0
VREG - VCC
Tj =-40C Tj =25C Tj =135C IREG = 30 mA
(mA)
Tj =135C 1.5
(V) Regulator voltage VREG
7.5 7.0 6.5 16 18 6.0 12
Tj =25C
Current dissipation
ICC
1.0
0.5
0 12
14
14
16
18
Control power supply voltage
VCC
(V)
Control power supply voltage
VCC
(V)
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ton - Tj
3.0 VBB = 280 V VCC = 15 V IC = 0.5 A High-side Low-side 3.0 VBB = 280 V VCC = 15 V IC = 0.5 A
toff - Tj (s)
(s)
ton
2.0
toff
2.0
High-side Low-side
Output-on delay time
Output-off delay time
1.0
1.0
0 -50
0
50
100
150
0 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
VCCUV - Tj
12.5 10.5 VCCUVD VCCUVR 12.0
VBSUV - Tj Under-voltage protection operating voltage VBSUV (V)
VBSUVD VBSUVR 10.0
Under-voltage protection operating voltage VCCUV (V)
11.5
9.5
11.0
9.0
10.5
8.5
10.0 -50
0
50
100
150
8.0 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
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IBS (ON) - VBS
500 500
IBS (OFF) - VBS (A)
Tj =-40C Tj =25C Tj =135C 400
IBS (ON) (A)
Tj =-40C Tj =25C Tj =135C 400
Current dissipation
200
Current dissipation
300
IBS (OFF)
300
200
100 12
14
16
18
100 12
14
16
18
Control power supply voltage
VBS
(V)
Control power supply voltage
VBS
(V)
Wton - Tj
250 50
Wtoff - Tj
(J)
(J) Wtoff
200
40
Wton
150
IC = 700 mA
30
IC = 700 mA IC = 500 mA
Turn-on loss
100
IC = 500 mA IC = 300 mA
Turn-off loss
20 IC = 300 mA 10
50
0 -50
0
50
100
150
0 -50
0
50
100
150
Junction temperature
Tj
(C)
Junction temperature
Tj
(C)
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Test Circuits
1 GND 26 IS3 26 IS3 2 NC 3 NC 25 W 24 BSW 4 HU 5 HV 6 HW 23 VBB 7 LU 8 LV 9 LW 10 SD 11 DIAG 20 IS2 19 IS1 12 NC 13 VREG 14 NC 15 VCC 16 GND 18 BSU 17 U 20 IS2 19 IS1 21 BSV 1 GND
2 NC 25 W 24 BSW
3 NC
4 HU
5 HV
6 HW 23 VBB
7 LU
FRD Forward Voltage (U-phase low side)
8 LV 22 V 21 BSV
22 V
IGBT Saturation Voltage (U-phase low side)
9 LW
10 SD
16
VM
18 BSU 17 U
11 DIAG
12 NC
13 VREG
14 NC
VM
15 VCC
16 GND
0.5A HU = 0V HV = 0V HW = 0V LU = 5V LV = 0V LW = 0V VCC = 15V
0.5A
TPD4123AK
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1 GND 26 IS3 2 NC 3 NC 25 W 24 BSW 4 HU 5 HV 23 VBB 7 LU 8 LV 9 LW 21 BSV 10 SD 11 DIAG 20 IS2 19 IS1 12 NC 13 VREG 14 NC 18 BSU 17 U 15 VCC 18 BSU 20 IS2 19 IS1 21 BSV 6 HW 23 VBB 26 IS3
1 GND
Regulator Voltage
2 NC 25 W 24 BSW
3 NC
VCC Current Dissipation
4 HU
5 HV
6 HW
7 LU
8 LV 22 V
22 V
9 LW
10 SD
17
IM
11 DIAG
VM
12 NC
13 VREG
30mA VCC = 15V
14 NC
15 VCC
16 GND
16 GND
17 U
TPD4123AK
VCC = 15V
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Output ON/OFF Delay Time (U-phase low side)
IM
U = 280V
2.2F
560
24 BSW
11 DIAG
13 VREG
1 GND
18 BSU
21 BSV
23 VBB
26 IS3
20 IS2
19 IS1
25 W
16 GND
15 VCC
6 HW
2 NC
3 NC
4 HU
12 NC
14 NC
9 LW
10 SD
5 HV
7 LU
8 LV
17 U
22 V
HU = 0V HV = 0V HW = 0V LU = PG LV = 0V LW = 0V VCC = 15V
90% LU = PG 10%
90%
IM
10%
ton
toff
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VCC Under-voltage Protection Operating/Recovery Voltage (U-phase low side)
U = 18V 2k
24 BSW
11 DIAG
13 VREG
1 GND
18 BSU
21 BSV
23 VBB
26 IS3
20 IS2
19 IS1
25 W
16 GND
15 VCC
6 HW
2 NC
3 NC
4 HU
12 NC
14 NC
9 LW
10 SD
5 HV
7 LU
8 LV
17 U
22 V
VM
HU = 0V HV = 0V HW = 0V LU = 5V LV = 0V LW = 0V VCC = 15V 6V 6V 15V
*Note: Sweeps the VCC pin voltage from 15 V and monitors the U pin voltage. The VCC pin voltage when output is off defines the under-voltage protection operating voltage. Also sweeps from 6 V to increase. The VCC pin voltage when output is on defines the under voltage protection recovery voltage.
VBS Under-voltage Protection Operating/Recovery Voltage (U-phase high side)
VBB = 18V 2k
VM
BSU = 15V 6V 6V 15V
24 BSW
11 DIAG
13 VREG
1 GND
18 BSU
21 BSV
23 VBB
26 IS3
20 IS2
19 IS1
25 W
16 GND
15 VCC
6 HW
2 NC
3 NC
4 HU
12 NC
14 NC
9 LW
10 SD
5 HV
7 LU
8 LV
17 U
22 V
HU = 5V HV = 0V HW = 0V LU = 0V LV = 0V LW = 0V VCC = 15V *Note: Sweeps the BSU pin voltage from 15 V to decrease and monitors the VBB pin voltage. The BSU pin voltage when output is off defines the under voltage protection operating voltage. Also sweeps the BSU pin voltage from 6V to increase and change the HU pin voltage at 5 V0 V5 V each time. It repeats similarly output is on. When the BSU pin voltage when output is on defines the under voltage protection recovery voltage.
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1 GND 26 IS3 2 NC 3 NC 25 W 24 BSW 4 HU 5 HV 6 HW 7 LU 8 LV 9 LW 10 SD 11 DIAG 12 NC 13 VREG 14 NC 15 VCC 16 GND 18 BSU 17 U 20 IS2 19 IS1 21 BSV 23 VBB
VBS Current Dissipation (U-phase high side)
22 V
20
HU = 0V/5V HV = 0V HW = 0V LU = 0V LV = 0V LW = 0V VCC = 15V
IM
TPD4123AK
BSU = 15V
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Turn-On/Off Loss (low side IGBT + high side FRD)
5mH L 2.2F
IM VM
VBB/U = 280V
24 BSW
11 DIAG
13 VREG
1 GND
18 BSU
21 BSV
23 VBB
26 IS3
20 IS2
19 IS1
25 W
16 GND
15 VCC
6 HW
2 NC
3 NC
4 HU
12 NC
14 NC
9 LW
10 SD
5 HV
7 LU
8 LV
17 U
22 V
HU = 0V HV = 0V HW = 0V LU = PG LV = 0V LW = 0V VCC = 15V
Input (LU = PG)
IGBT (C-E Voltage) (U-GND)
Power Supply Current
Wtoff
Wton
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Package Dimensions
HDIP26-P-1332-2.00
Unit : mm
Weight: 3.8 g (typ.)
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RESTRICTIONS ON PRODUCT USE
* The information contained herein is subject to change without notice.
20070701-EN GENERAL
* TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the "Handling Guide for Semiconductor Devices," or "TOSHIBA Semiconductor Reliability Handbook" etc. * The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage"). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his document shall be made at the customer's own risk. * The products described in this document shall not be used or embedded to any downstream products of which manufacture, use and/or sale are prohibited under any applicable laws and regulations. * Please contact your sales representative for product-by-product details in this document regarding RoHS compatibility. Please use these products in this document in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses occurring as a result of noncompliance with applicable laws and regulations.
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